Effect of lubricant environment on saw damage in silicon wafers

The chemomechanical effect of lubricant environments on the inner diameter (ID) sawing induced surface damage in Si wafers was tested for four different lubricants: water, dielectric oil, and two commercial cutting solutions. The effects of applying different potential on Si crystals during the sawing were also tested. It is indicated that the number and depth of surface damage are sensitive to the chemical nature of the saw lubricant. It is determined that the lubricants that are good catalysts for breaking Si bonds can dampen the out of plane blade vibration more effectively and produce less surface damage. Correlations between the applied potential and the depth of damage in the dielectric oil and one of the commercial cutting solutions and possible mechanisms involved are discussed

A VLSI design for a systolic Viterbi decoder

A systolic Viterbi decoder for convolutional codes is developed. This decoder uses the trace-back method to reduce the amount of data needed to be stored in registers. It is shown that this new algorithm requires a smaller chip size and achieves a faster decoding time than other existing methods

Thermal analysis of cathode and anode regimes of an MPD arc Summary report, Jun. 1965 - Jan. 1967

Thermal analysis of anode and cathode heat transfer in magnetohydrodynamic electric arc

Study on Control of the Odour Problem in Polluted Engineered Channel KT-5, Tai Kong Po (at Kam Tin, Yuen Long)

A report to Drainage Services Department, HKSAR Governmentpublished_or_final_versio